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SAE ARP6415

Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
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SAE ARP6415

Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

PUBLISH DATE 2019
PAGES 32
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This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.
SDO SAE: SAE International
Document Number ARP6415
Publication Date July 23, 2019
Language en - English
Page Count 32
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
July 23, 2019 ARP6415 Revision