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IPC SMC-WP-004

Design for Success
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC SMC-WP-004

Design for Success

IPC SMC-WP-004
Design for Success
Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Committee
Publish Date Document Id Type View
Not Available SMC-WP-004 Revision