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IPC MILMKT12-11-FINFIN

Final Finish for Connectivity
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC MILMKT12-11-FINFIN

Final Finish for Connectivity

IPC MILMKT12-11-FINFIN
Final Finish for Connectivity
Final Finish for Connectivity was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC standards where they apply to the materials. This presentation includes the synchronized slides and audio. 24 minutes. Released 2012.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number FINFIN
Publication Date Not Available
Language en - English
Page Count
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Not Available MILMKT12-11-FINFIN Revision