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IPC J-STD-027

Mechanical Outline Standard for Flip Chip and Chip Size Configurations
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC J-STD-027

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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Mechanical Outline Standard for Flip Chip and Chip Size Configurations
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J027
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Publish Date Document Id Type View
Not Available J-STD-027 Revision