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IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation
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IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation

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Guidelines for Chip-on-Board Technology Implementation
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number SM784
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-SM-784 Revision