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IPC-L-108B

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-L-108B

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

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Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number L108
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-L-108B Revision