Logo
Login Sign Up
Current Consolidated

IPC/JEDEC-J-STD-033C-1

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Best Price Guarantee

$103.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC/JEDEC-J-STD-033C-1

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

Document Preview
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 18 pages.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J033
Publication Date Not Available
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC/JEDEC J-STD-033D Revision
Not Available IPC/JEDEC J-STD-033C Revision
Not Available IPC/JEDEC J-STD-033B Revision
Not Available IPC/JEDEC J-STD-033A Revision
Not Available IPC/JEDEC J-STD-033 Revision
Not Available IPC/JEDEC-J-STD-033C-1 Consolidated
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision