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IPC/JEDEC-9704

Printed Circuit Assembly Strain Gage Test Guideline
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC/JEDEC-9704

Printed Circuit Assembly Strain Gage Test Guideline

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Printed Wiring Board Strain Gage Test Guideline
Printed Wiring Board Strain Gage Test Guideline
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9704
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC/JEDEC-9704A Revision
Not Available IPC/JEDEC-9704 Revision
Not Available IPC/JEDEC-9704A CN Revision