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IPC/JEDEC-9301

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
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IPC/JEDEC-9301

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9301
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC/JEDEC-9301 Revision