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IPC-J-STD-006C-AM1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-J-STD-006C-AM1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - AM1
The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the IPC-J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the IPC J-STD-006C standard.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J006
Publication Date Not Available
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B Revision
Not Available IPC-J-006A Revision
Not Available IPC J-STD-006 Revision
Not Available IPC J-STD-006B WAM 1 Consolidated
Not Available IPC-J-STD-006B-WAM1,2 Consolidated
Not Available IPC-J-STD-006C Revision
Not Available IPC-J-STD-006C Revision
Not Available IPC J-STD-006B CN Revision
Not Available IPC J-STD-006B RU Revision
Not Available IPC-J-STD-006B Revision
Not Available IPC-J-STD-006B-WAM1,2 Consolidated