Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - AM1
The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the IPC-J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the IPC J-STD-006C standard.
| SDO | IPC: Institute for Interconnecting and Packaging Electronic Circuits |
| Document Number | J006 |
| Publication Date | Not Available |
| Language | en - English |
| Page Count | |
| Revision Level | C |
| Supercedes | |
| Committee |