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IPC-J-STD-004B w/Amend 1

Requirements for Soldering Fluxes
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IPC-J-STD-004B w/Amend 1

Requirements for Soldering Fluxes

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Requirements for Soldering Fluxes - includes Amendment 1
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J004
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-J-STD-004D Revision
Not Available IPC-J-STD-004C Revision
Not Available IPC J-STD-004B Revision
Not Available IPC-J-STD-004B w/Amend 1 Revision
Not Available IPC-J-STD-004A Revision
Not Available IPC-J-004 Revision
Not Available IPC-J-STD-004C-WAM1 Consolidated
Not Available IPC-J-STD-004C Revision
Not Available IPC-J-STD-004C Revision
Not Available IPC-J-STD-004B Revision
Not Available IPC J-STD-004B RU Revision
Not Available IPC-J-STD-004A Revision
Not Available IPC-J-STD-004A Revision
Not Available IPC-J-STD-004B-WAM1 Consolidated