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IPC-HM-860

Specification for Multilayer Hybrid Circuits
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-HM-860

Specification for Multilayer Hybrid Circuits

IPC-HM-860
Specification for Multilayer Hybrid Circuits
Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number HM860
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-HM-860 Revision