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IPC-FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating proper assemblies and bare printed boards. 28 pages. Released 2014.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number FC234
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-FC-234A Revision
Not Available IPC-FC-234 Revision