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IPC/EIA-J-STD-028

Performance Standard for Construction of Flip Chip and Chip Scale Bumps
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IPC/EIA-J-STD-028

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

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Performance Standard for Construction of Flip Chip and Chip Scale Bumps
This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set of designations and expectations for product performance for the manufacturer and the user of flip chip or chip scale devices. Recommendations are provided to implement the best commercial practices and evolving process improvements. Developed by IPC and EIA. 36 Pages. Released August 1999.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number J028
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC/EIA-J-STD-028 Revision