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IPC-CH-65B

Guidelines for Cleaning of Printed Boards and Assemblies
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-CH-65B

Guidelines for Cleaning of Printed Boards and Assemblies

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Guidelines for Cleaning of Printed Boards and Assemblies
This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. Color pictures help with understanding. 200 pages.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number CH65
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-CH-65B Revision
Not Available IPC-CH-65A Revision
Not Available IPC-CH-65 Revision
Not Available IPC-CH-65B Revision