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IPC-9702-WAM1

Monotonic Bend Characterization of Board-Level Interconnects
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IPC-9702-WAM1

Monotonic Bend Characterization of Board-Level Interconnects

IPC-9702-WAM1
Monotonic Bend Characterization of Board-Level Interconnects
This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9702
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-9702-WAM1 Consolidated
Not Available IPC-9702 Revision