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IPC-9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

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Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9701
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-9701B Revision
Not Available IPC-9701A Revision
Not Available IPC-9701 Revision
Not Available IPC-9701A-CN Revision