Logo
Login Sign Up
Current Revision

IPC-9502

PWB Assembly Soldering Process Guideline for Electronic Components
Best Price Guarantee
Instant

$103.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-9502

PWB Assembly Soldering Process Guideline for Electronic Components

Document Preview
PWB Assembly Soldering Process Guideline for Electronic Components
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 9502
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-9502 Revision