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IPC-7527

Requirements for Solder Paste Printing
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-7527

Requirements for Solder Paste Printing

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Requirements for Solder Paste Printing
This standard is a collection of visual quality acceptability criteria for solder paste printing. It provides a standardized language for solder paste characterization. It provides users with common descriptions and potential causes for solder paste deposits. The standard provides valuable insights to the solder paste printing operations which can be used in troubleshooting of the printing process.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7527
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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