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IPC-7352

Generic Guideline for Land Pattern Design
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Generic Guideline for Land Pattern Design
IPC-7352 Generic Guideline for Land Pattern Design provides generic guidelines on land pattern geometries used for the attachment of electronic components to a printed board, as well as design recommendations for achieving the best possible solder joints to the devices assembled. IPC-7352 is an essential tool for helping printed board designers to achieve these optimal results.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7352
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7352 Revision