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IPC-7095D-WAM1

Design and Assembly Process Implementation for BGAs
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-7095D-WAM1

Design and Assembly Process Implementation for BGAs

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Design and Assembly Process Implementation for BGAs, with Amendment 1
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7095
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7095C Revision
Not Available IPC-7095B Revision
Not Available IPC-7095A Revision
Not Available IPC-7095 Revision
Not Available IPC-7095D-WAM1 Consolidated
Not Available IPC-7095C Revision
Not Available IPC-7095D-WAM1 Consolidated
Not Available IPC-7095D-WAM1 Consolidated