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IPC-7092A

Design and Assembly Process Implementation for Embedded Circuitry
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-7092A

Design and Assembly Process Implementation for Embedded Circuitry

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Design and Assembly Process Implementation for Embedded Circuitry
IPC-7092A standard describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. IPC-7092A covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 7092
Publication Date Not Available
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-7092A Revision
Not Available IPC-7092 Revision
Not Available IPC-7092 Revision