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IPC-6018DS

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-6018DS

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018. Supersedes IPC-6018CS.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6018
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6018D Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision
Not Available IPC-6018A Revision
Not Available IPC-6018 Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision