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Historical Revision

IPC-6018C

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-6018C

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6018
Publication Date Not Available
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6018D Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision
Not Available IPC-6018A Revision
Not Available IPC-6018 Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision