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IPC-6018D

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-6018D

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
The IPC-6018D standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6018D incorporates many new requirements in areas such as back-drilled holes, alternative surface finishes, pad/land anomalies, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, plating overhang/slivers and dielectric removal. For use with IPC-6011.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6018
Publication Date Not Available
Language en - English
Page Count
Revision Level D
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6018D Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision
Not Available IPC-6018A Revision
Not Available IPC-6018 Revision
Not Available IPC-6018C Revision
Not Available IPC-6018B Revision