Logo
Login Sign Up
Current Revision

IPC-6015

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Best Price Guarantee
Instant

$103.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-6015

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Document Preview
Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 6015
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-6015 Revision