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IPC-4761

Design Guide for Protection of Printed Board Via Structures
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-4761

Design Guide for Protection of Printed Board Via Structures

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Design Guide for Protection of Printed Board Via Structures
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for employing each type of via protection. 16 pages. Released July 2006.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4761
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-4761 Revision