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IPC-HDBK-4691

Handbook on Adhesive Bonding in Electronic Assembly Operations
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-HDBK-4691

Handbook on Adhesive Bonding in Electronic Assembly Operations

IPC-HDBK-4691
Handbook on Adhesive Bonding in Electronic Assembly Operations
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4691
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-HDBK-4691 Revision
Not Available IPC-HDBK-4691 Revision