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IPC-4562B

Specification for Metal Base Copper Clad Laminates for Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-4562B

Specification for Metal Base Copper Clad Laminates for Printed Boards

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Specification for Metal Base Copper Clad Laminates for Printed Boards
IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4562
Publication Date Not Available
Language en - English
Page Count
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-4562B Revision
Not Available IPC-4562A Revision
Not Available IPC-4562 Revision
Not Available IPC-4562A-WAM1 Consolidated
Not Available IPC-4562A Revision