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IPC-4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
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IPC-4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

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Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4555
Publication Date Not Available
Language en - English
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Revision Level 0
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Publish Date Document Id Type View
Not Available IPC-4555 Revision