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IPC-4104

Specification for High Density Interconnect (HDI) and Microvia Materials
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-4104

Specification for High Density Interconnect (HDI) and Microvia Materials

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Specification for High Density Interconnect (HDI) and Microvia Materials
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 4104
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-4104 Revision