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IPC-3408

General Requirements for Anisotropically Conductive Adhesives Films
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IPC-3408

General Requirements for Anisotropically Conductive Adhesives Films

IPC-3408
General Requirements for Anisotropically Conductive Adhesives Films
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 25 pages. Released November 1996.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 3408
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-3408 Revision