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IPC-2614

Sectional Requirements for Board Fabrication Documentation
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-2614

Sectional Requirements for Board Fabrication Documentation

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Sectional Requirements for Board Fabrication Documentation
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions. 59 pages. Released March 2010.Included in C-102, C-105, C-106 and C-1000
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2614
Publication Date Not Available
Language en - English
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