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IPC-2315

Design Guide for High Density Interconnects & Microvias
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-2315

Design Guide for High Density Interconnects & Microvias

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Design Guide for High Density Interconnects & Microvias
Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and manufacturers one source for reliable design and manufacturability information for commonly produced HDI boards. Includes over 30 full color illustrations. 33 pages. Released June 2000.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2315
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-2315 Revision