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IPC-2223E

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-2223E

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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挠性和刚挠印制板设计分标准
IPC-2223与IPC-2221一起使用时,IPC-2223确立了挠性印制板设计以及组件安装和互连结构形式的特定要求。 结构中使用的挠性材料由绝缘膜,增强和/或非增强电介质与金属材料组成。 IPC-2223E为制造图纸,孔到边的间距,弯曲区域的导体注意事项,刚性和挠性区域之间的介电厚度以及双行零插入力(ZIF)连接器提供了新的设计指南和要求
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 2223
Publication Date Not Available
Language zh - Chinese
Page Count
Revision Level E
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-2223E Revision
Not Available IPC-2223D Revision
Not Available IPC-2223C Revision
Not Available IPC-2223B Revision
Not Available IPC-2223A Revision
Not Available IPC-2223 Revision
Not Available IPC-2223E Revision
Not Available IPC-2223C CN Revision
Not Available IPC-2223C DE Revision
Not Available IPC-2223B DE Revision
Not Available IPC-2223A Revision