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IPC-TR-1

An Introduction to Tape Automated Bonding Fine Pitch Technology
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Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-TR-1

An Introduction to Tape Automated Bonding Fine Pitch Technology

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An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 1
Publication Date Not Available
Language en - English
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Revision Level 0
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Not Available IPC-TR-1 Revision