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IPC-WP-009

A Summary of Tin Whisker Research References
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IPC-WP-009

A Summary of Tin Whisker Research References

IPC-WP-009
A Summary of Tin Whisker Research References
As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the predominant research on tin whiskers as of September, 2008. 15 pages. Released March 2009.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number TW009
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
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Not Available IPC-WP-009 Revision