Logo
Login Sign Up
Current Revision

IPC-0040

Optoelectronic Assembly and Packaging Technology
Best Price Guarantee
Instant

$183.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
Institute for Interconnecting and Packaging Electronic Circuits Logo

IPC-0040

Optoelectronic Assembly and Packaging Technology

IPC-0040
Optoelectronic Assembly and Packaging Technology - Single User Download
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 163 pages. Released May 2003. Preview the table of contents .pdf file.
SDO IPC: Institute for Interconnecting and Packaging Electronic Circuits
Document Number 40
Publication Date Not Available
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
Not Available IPC-0040 Revision