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BSI PD IEC/TS 62647-4:2018

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling
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BSI PD IEC/TS 62647-4:2018

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling

PUBLISH DATE 2018
PAGES 44
BSI PD IEC/TS 62647-4:2018
Ball grid array (BGA) re-balling
SDO BSI: British Standards Institution
Document Number PD IEC/TS 62647
Publication Date April 25, 2018
Language en - English
Page Count 44
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
April 25, 2018 PD IEC/TS 62647-4:2018 Revision