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BSI DD IEC/TS 62454:2007

Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
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BSI DD IEC/TS 62454:2007

Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

PUBLISH DATE 2007
PAGES 22
BSI DD IEC/TS 62454:2007
PROVISIONS FOR WATER COOLING OF ELECTRONIC EQUIPMENT WITHIN
SDO BSI: British Standards Institution
Document Number DD IEC/TS 62454
Publication Date Nov. 30, 2007
Language en - English
Page Count 22
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Nov. 30, 2007 DD IEC/TS 62454:2007 Revision