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BSI BS IEC 62047-35:2019

Semiconductor devices. Micro-electromechanical devices. Test method of electrical characteristics under bending deformation for flexible electromechanical devices.
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BSI BS IEC 62047-35:2019

Semiconductor devices. Micro-electromechanical devices. Test method of electrical characteristics under bending deformation for flexible electromechanical devices.

PUBLISH DATE 2021
PAGES 24
BSI BS IEC 62047-35:2019
Electrical characteristics under bending deformation for flexible electromechanical devices.
SDO BSI: British Standards Institution
Document Number BS IEC 62047-35
Publication Date April 20, 2021
Language en - English
Page Count 24
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
April 20, 2021 BS IEC 62047-35:2019 Revision