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BSI BS IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies.Test methods for time to delamination. T260, T288, T300.
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BSI BS IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies.Test methods for time to delamination. T260, T288, T300.

PUBLISH DATE 2023
PAGES 12
BSI BS IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies.Test methods for time to delamination. T260, T288, T300.
SDO BSI: British Standards Institution
Document Number BS IEC 61189
Publication Date Aug. 30, 2023
Language en - English
Page Count 12
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Aug. 30, 2023 BS IEC 61189-2-804:2023 Revision