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BSI BS IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Thermal conductivity test for base materials.
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BSI BS IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Thermal conductivity test for base materials.

PUBLISH DATE 2023
PAGES 14
BSI BS IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Thermal conductivity test for base materials.
SDO BSI: British Standards Institution
Document Number BS IEC 61189
Publication Date Aug. 3, 2023
Language en - English
Page Count 14
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Aug. 3, 2023 BS IEC 61189-2-801:2023 Revision