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BSI BS IEC 60068-2-69:2007

Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
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BSI BS IEC 60068-2-69:2007

Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

PUBLISH DATE 2007
PAGES 28
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BS-EN-60068-2-69
SDO BSI: British Standards Institution
Document Number BS IEC 60068
Publication Date July 31, 2007
Language en - English
Page Count 28
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
July 31, 2007 BS IEC 60068-2-69:2007 Revision