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BSI BS EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress.
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BSI BS EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress.

PUBLISH DATE 2023
PAGES 26
BSI BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress.
SDO BSI: British Standards Institution
Document Number BS EN IEC 63251
Publication Date Dec. 19, 2023
Language en - English
Page Count 26
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Dec. 19, 2023 BS EN IEC 63251:2023 Revision