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BSI BS EN IEC 61760-3:2021

Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering.
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BSI BS EN IEC 61760-3:2021

Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering.

PUBLISH DATE 2021
PAGES 34
BSI BS EN IEC 61760-3:2021
Specification of components for through-hole reflow (THR) soldering.
SDO BSI: British Standards Institution
Document Number BS EN IEC 61760
Publication Date March 18, 2021
Language en - English
Page Count 34
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
March 18, 2021 BS EN IEC 61760-3:2021 Revision