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BSI BS EN IEC 60749-37:2022

Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer.
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BSI BS EN IEC 60749-37:2022

Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer.

PUBLISH DATE 2022
PAGES 28
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Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer.
SDO BSI: British Standards Institution
Document Number BS EN IEC 60749
Publication Date Nov. 22, 2022
Language en - English
Page Count 28
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Nov. 22, 2022 BS EN IEC 60749-37:2022 Revision