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BSI BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices
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BSI BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

PUBLISH DATE 2015
PAGES 48
BSI BS EN 62137-4:2014
array type package surface mount devices
SDO BSI: British Standards Institution
Document Number BS EN 62137-4
Publication Date Feb. 28, 2015
Language en - English
Page Count 48
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Feb. 28, 2015 BS EN 62137-4:2014 Revision