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BSI BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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BSI BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

PUBLISH DATE 2009
PAGES 38
BSI BS EN 60749-20-1:2009
and SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINE
SDO BSI: British Standards Institution
Document Number BS EN 60749
Publication Date July 31, 2009
Language en - English
Page Count 38
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
July 31, 2009 BS EN 60749-20-1:2009 Revision