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BSI BS EN 60191-6-19:2010

Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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BSI BS EN 60191-6-19:2010

Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

PUBLISH DATE 2010
PAGES 18
BSI BS EN 60191-6-19:2010
PACKAGE WARPAGE AT ELEVATED TEMPERATURE and THE MAXIMUM PERMIS
SDO BSI: British Standards Institution
Document Number BS EN 60191
Publication Date June 30, 2010
Language en - English
Page Count 18
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
June 30, 2010 BS EN 60191-6-19:2010 Revision